Semiconductor CFD Consulting - Computational Fluid Dynamics
 

JLR has performed significant CFD work on semiconductor manufacturing processes to optimize and accurately analyze the resulting complex reacting flow. CFD is extremely useful and cost-effective in minimizing prototyping of various process designs reducing cost and man hours required. In addition, it is also extremely useful in understanding and optimizing flow patters resulting in proper coating processes and thickness studies of wafers. Virtual process development can get your within your process window quicker, cheaper, more reliabily.

Specifically CFD can be used to accurately analyze processes such as spin coating and Chemical Vapor Deposition (CVD) processes. Generally, CFD can model most wet processes and is an excellent tool for running virtual experiments (DOE) to speed development time.

Spin Coating:
Using Finite volume methods, CFD can accurately predict coating thickness and uniformities associated with any spin coating process. We have used this to analyze and optimize spin coating processes features and chambers. Specifically this can be used to select the correct “RPM recipe” to obtain the optimal coating; the air flow patters above the wafer and its effects; and thermal effects on the coating.

Chemical Vapor Deposition  - CVD:
CFD can also be used to analyze both hot and cold Chemical Vapor Deposition methods for manufacturing wafers. Fluent can accurately handle both volumetric and surface based chemical reactions. Examples include decomposition reactions using Silane, Tricholorosilane etc. Using this we can accurately analyze reactions of input gases and outlet products, deposition of products onto the wafers, thermal effects, effects of flow and reaction patters on the deposition. We have optimized flow rates, deposition uniformity, and overall design of CVD chambers using such analyses with high accuracy and validation. This has resulted in rapid analysis of multiple chamber designs and flow rate patters to produce the most optimal set of conditions for uniform coating of desired pattern and thickness. Such analyses also radically reduce overall cost and actual man hours involved with physical prototyping.

Contact us today for an initial review of your engineering problem.  Let our expertise in semiconductor manufacturing processes, fluid mechanics, & CFD enable you to make faster, more reliable decisions for your product or process, failure analysis, or reliability modeling needs.

We have offices located across North America. Satellite offices are located in Rochester, New York; Toronto, Canada; Montreal, Canada; Atlanta, Georgia; and Cleveland, Ohio.